Xeon X3470 specifications
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General information
Type CPU / Microprocessor
Market segment Server
Family I Xeon 3400
Model number ? X3470
CPU part numbers BV80605001905AJ is an OEM/tray microprocessor
BX80605X3470 is a boxed microprocessor
Frequency ? 2933 MHz
Maximum turbo frequency 3600 MHz (1 c)
3467 MHz (2 cores)
3200 MHz (3 or 4 cores)
Bus speed ? 2.5 GT/s
Clock multiplier ? 22
Package 1156-land Flip-Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm)
Socket Socket 1156 / H1 / LGA1156
Introduction date Sep 8, 2009
End-of-Life date Last order date is December 28, 2012
Last shipment date for tray processors is December 6, 2013
Price at introduction $589
S-spec numbers
Part number ES/QS processors Production processors
Q3AK SLBJH
BV80605001905AJ + +
BX80605X3470 +
Architecture / Microarchitecture
Microarchitecture Nehalem
Platform Foxhollow-WS
Processor c ? Lynnfield
c stepping ? B1 (Q3AK, SLBJH)
CPUID 106E5 (SLBJH)
Manufacturing process 0.045 micron
774 million transistors
Die 296mm2
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size ? 4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size ? 4 x 256 KB 8-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 32 GB
Multiprocessing Uniprocessor
Extensions and Technologies MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
EM64T / Extended Memory 64 technology / I 64 ?
NX / XD / Execute disable bit ?
HT / Hyper-Threading technology ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
TBT / Turbo Boost technology ?
TXT / Trusted Execution technology
Low power features Thread C1/C1E, C3 and C6 states
c C1/C1E, C3 and C6 states
Package C1/C1E, C3 and C6 states
Enhanced / technology ?
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-800, DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
ECC supported: Yes
Other peripherals Direct Media Interface
PCI Express 2.0 interface
Electrical / Thermal parameters
V c ? 0.65V - 1.4V
Maximum operating temperature ? 72.7°C
Maximum power dissipation ? 189.78 Watt (peak)
160.08 Watt (sustained)
Thermal Design Power ? 95 Watt