Sturdy Aluminum Alloy Build - This BGA reballing station uses robust aluminum alloy material, providing a lightweight yet strong structure that withstands daily workshop use without oxidation or material breakdown.
Universal Diagonal Stencil Design - Our reballing kit fits BGA chips from 9mm to 43mm, featuring adjustable size knobs and diversion grooves that simplify tin bead removal for accurate soldering on laptops and phones.
Oxidation-Inhibiting Plating - Aluminum alloy plating prevents oxidation, ensuring long-term performance for electronics repair professionals working with CPUs, mobile devices, and digital products.
Efficient Tin Bead Management - The diversion groove design allows quick pour-out of excess tin beads, reducing cleanup time and improving workflow efficiency during BGA manual welding tasks.
Complete Repair Solution - This rework station includes a hex wrench and supports standard 90x90mm steel meshes, offering a dependable tool for plant tin rework with minimized operational risks.
وصف
Frustrated with inaccurate BGA reballing that damages precious chips? Imagine achieving consistent solder balls every time without oxidation or sizing issues. Our HT-90 BGA Reballing Station delivers accuracy with its universal diagonal stencil design for 9mm-43mm chips. The aluminum alloy construction resists material breakdown while the diversion groove streamlines tin bead disposal. Specifically engineered for laptop CPU and phone repair, this kit includes a hex wrench and supports 90x90mm steel meshes—your solution for consistent, manual BGA welding.
Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.
Package List:
1 x BGA Reballing Station
1 x Hex Wrench