Frustrated with inconsistent BGA reballing results? Damaging precious chips during repair can cost hundreds in replacements. Imagine achieving excellent solder ball alignment every time—quicker repairs, happier clients, and increased workshop revenue. Our HT-80H BGA Reballing Station solves this with its universal aluminum alloy fixture fitting 9mm to 43mm chips. The electroplated finish guards against oxidation while the steel mesh stencil ensures accuracy. Includes 5 accessories and hex wrench for complete phone, laptop, and CPU repair readiness.
Item Type: For BGA Reballing Station
Product Model: HT-80H
Material: Aluminum alloy
Uses: For BGA manual welding for cell phone, chip, laptop CPU, cell phone digital products plant tin rework.
Features: For BGA universal reballing station with all aluminum alloy electroplating, not easy to oxidize, and more abrasion-proof.
Application: Suitable for all for BGA chip ball planting, regardless of rectangular or square chip.
Suitable for BGA chip reballing of approx. 9 x 9mm / 0.4 x 0.4in to approx. 43 x 43mm / 1.7 x 1.7in chips.

Package List：
1 x For BGA Reballing Station(5pcs removable accessories)
1 x Hex Wrench