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Electronic Potting Compound, Thermally Conductive Epoxy Thermal Adhesive Insulation Waterproof Sealant for Electronic Component Packaging Led Power Supply Circuit Board Protection, 480g A+B in Kuwait Electronic Potting Compound, Thermally Conductive Epoxy Thermal Adhesive Insulation Waterproof Sealant for Electronic Component Packaging Led Power Supply Circuit Board Protection, 480g A+B in Kuwait Electronic Potting Compound, Thermally Conductive Epoxy Thermal Adhesive Insulation Waterproof Sealant for Electronic Component Packaging Led Power Supply Circuit Board Protection, 480g A+B in Kuwait Electronic Potting Compound, Thermally Conductive Epoxy Thermal Adhesive Insulation Waterproof Sealant for Electronic Component Packaging Led Power Supply Circuit Board Protection, 480g A+B in Kuwait Electronic Potting Compound, Thermally Conductive Epoxy Thermal Adhesive Insulation Waterproof Sealant for Electronic Component Packaging Led Power Supply Circuit Board Protection, 480g A+B in Kuwait Electronic Potting Compound, Thermally Conductive Epoxy Thermal Adhesive Insulation Waterproof Sealant for Electronic Component Packaging Led Power Supply Circuit Board Protection, 480g A+B in Kuwait Electronic Potting Compound, Thermally Conductive Epoxy Thermal Adhesive Insulation Waterproof Sealant for Electronic Component Packaging Led Power Supply Circuit Board Protection, 480g A+B in Kuwait

Electronic Potting Compound, Thermally Conductive Epoxy Thermal Adhesive Insulation Waterproof Sealant for Electronic Component Packaging Led Power Supply Circuit Board Protection, 480g A+B

KWD 6
KWD 7

Brand
WANJAO
Category
Sealants
Weight
472 g
1 +

Special Features

  • Insulation and Waterproofing: The potting compound has excellent insulation and waterproofing properties, effectively preventing the ingress of water , and protecting electronic.
  • Easy to Use:Two-component thermal epoxy(400g A glue + 80g B glue),weigh the AB materials ratio of 5:1,mix stir them evenly,into the objects that need to be poured,wait for cure .It usually takes 24hours to completely cure.
  • Strong adhesion: This thermally conductive epoxy has super-strong adhesion and can adhere tightly to the surface of various materials, forming a strong protective layer.
  • Temperature Resistance: Potting compound for electronics can withstand the temperature range of -40℃~120℃, this thermal conductive potting glue can maintain stable performance and will not crack or fail due to temperature fluctuations.
  • Wide Range of Applications: Circuit board glue excellent for PCB, Resistors, Intricate Circuitry and Components, ensuring safe and reliable device operation.

Description

How to use:
1. Weighing
Use an electronic scale to accurately weigh the AB materials at a weight ratio of 5:1 (stir the A glue thoroughly before weighing) to ensure that the resin on the container wall and bottom is fully stirred.
2. Proportion
Mix the weighed A and B materials and stir them evenly. When stirring manually, ensure that the resin on the container wall and bottom is fully dispersed.
3. Pouring
Pouring the mixed A and B materials into the objects that need to be poured, It usually takes 24 hours to completely cure.
4.Curing
24 hours at room temperature;
4-5 hours at 50-60°C;
To achieve better product properties, post-curing at 120'C for 4 hours is recommended.
Note:
1.Mixing ratio: Strictly follow the instructions (such as A:B=5:1), otherwise it may affect the curing effect.
2.When potting, please apply the adhesive evenly to ensure it completely covers the parts to be protected to avoid bubbles or gaps.
3.Curing conditions: Room temperature curing may take more than 24 hours.
4.Surface treatment: Please clean the potting area before use to achieve the best bonding effect.
5.Keep away from children to avoid accidental ingestion.

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