[HIGH-QUALITY STAINLESS STEEL] These stencils are crafted from top-grade stainless steel, ensuring durability and Ideal thickness for reballing work.
[HEAT tolerant DESIGN] They can withstand heat from hot air machines without deforming, providing reliable performance during use.
[MULTIPLE SIZES INCLUDED] With 6 different sizes and a total of 130 pieces, these stencils offer versatility to meet various reballing needs.
[CONVENIENT SPECIFICATIONS] The stencils are clearly marked with sizes, making it easy for users to select the right one for the job.
[VERSATILE APPLICATION] Specifically designed for BGA chips on laptops, desktops, communication main boards, and graphics cards, these stencils cater to a wide range of reballing tasks.

Spec:
These stencils were made by Superior material, can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Features:
These stencils are made of Superior stainless steel, the thickness of steel mesh is Ideal.
They can be heated by the hot air machine, these stencils are not easy to deform when heated.
There are 6 different sizes and totally 130pcs, enough to meet your various needs.
The specifications are marked on the surface, convenient for you to choose.
It is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips.

Specification:
Material: Stainless Steel
Color: Silver
Quantity: 130pcs
Weight: Approx. 268g / 9.5oz

Package List:
3pcs x BGA Stencils for 0.35mm Solder Ball
2pcs x BGA Stencils for 0.4mm Solder Ball
7pcs x BGA Stencils for 0.45mm Solder Ball
35pcs x BGA Stencils for 0.5mm Solder Ball
60pcs x BGA Stencils for 0.6mm Solder Ball
23pcs x BGA Stencils for 0.76mm Solder Ball

Note：