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Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning in Kuwait Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning in Kuwait Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning in Kuwait Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning in Kuwait Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning in Kuwait Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning in Kuwait Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning in Kuwait Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning in Kuwait Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning in Kuwait

Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning

KWD 3
Brand
Garosa
Weight
11 g
– 1 +

Special Features

  • [SIMPLE CARRYING]: Convenient size and lightweight design make it easy to carry and work on. The phone CPU rework stencil is for on-the-go repairs.
  • [STAINLESS STEEL DURABILITY]: Constructed from premium stainless steel, this stencil is built to last with a sturdy design. Ideal for long-term use and reliability.
  • [IC CHIP PROTECTION]: Special IC slots prevent small IC tin from sticking and breaking, ensuring the safety of your valuable components during reballing.
  • [QUICK TINNING SPEED]: Fast and accurate positioning for high-speed tinning, this stencil maintains its shape even under extreme temperatures. Efficiency at its best.
  • [ FITTING DESIGN]: Compatible with CPU and popular like 11, 11 Pro, and 11 Pro , this stencil offers precision and versatility for various repairs.

Description

Specification:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For
Applicable Product : For 11, for 11 Pro, for 11 Pro .

How to Use:
Directuse.

Package List:
1 xPhone CPU BGA Reballing Stencil
1 x
Phone CPU BGA Reballing Stencil

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