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Stainless Steel Compact Phone CPU BGA Reballing Stencil 0.12mm for 11, 11 Pro, Pro with Quick Tinning

KWD 3.500
Brand
Garosa
Weight
11 g
– 1 +

Special Features

  • [SIMPLE CARRYING]: Convenient size and lightweight design make it easy to carry and work on. The phone CPU rework stencil is for on-the-go repairs.
  • [STAINLESS STEEL DURABILITY]: Constructed from premium stainless steel, this stencil is built to last with a sturdy design. Ideal for long-term use and reliability.
  • [IC CHIP PROTECTION]: Special IC slots prevent small IC tin from sticking and breaking, ensuring the safety of your valuable components during reballing.
  • [QUICK TINNING SPEED]: Fast and accurate positioning for high-speed tinning, this stencil maintains its shape even under extreme temperatures. Efficiency at its best.
  • [ FITTING DESIGN]: Compatible with CPU and popular like 11, 11 Pro, and 11 Pro , this stencil offers precision and versatility for various repairs.

Description

Specification:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For
Applicable Product : For 11, for 11 Pro, for 11 Pro .

How to Use:
Directuse.

Package List:
1 xPhone CPU BGA Reballing Stencil
1 x
Phone CPU BGA Reballing Stencil

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