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Generic Copper Heat Sink, 401 Wmk Copper Material Pillow Pillow for IC Chips (15 * 15 * 0.3mm)

KWD 3.500

Brand
Generic
Category
Fans & Cooling
Weight
76 g
Size15*15*0.3mm
1 +

Special Features

  • Premium Materials: Made of copper, it is strong, durable, not easy to damage, and has a long service life.
  • Improving Thermal Conductivity: The small heatsink is used for thermal conductivity and aperture filling between the graphics card and the cooling module to improve thermal conductivity.
  • Burr : The copper heatsink has a glossy appearance, glossy edges and corners, no burrs, and is more suitable for your equipment.
  • Scope of Application: Suitable for desktop, laptop IC chips, graphics cards, CPU, VGA, RAM, VRAM, , M.2 SSD.
  • 401w/mk Thermal Conductivity: Heatsink thermal conductivity up to 401w/mk, powerful cooling for your equipment.

Description

1. 401w/mk Thermal Conductivity: Heatsink thermal conductivity up to 401w/mk, powerful cooling for your equipment.
2. Improving Thermal Conductivity: The small heatsink is used for thermal conductivity and aperture filling between the graphics card and the cooling module to improve thermal conductivity.
3. Premium Materials: Made of copper, it is strong, durable, not easy to damage, and has a long service life.
4. Burr : The copper heatsink has a glossy appearance, glossy edges and corners, no burrs, and is more suitable for your equipment.
5. Scope of Application: Suitable for desktop, laptop IC chips, graphics cards, CPU, VGA, RAM, VRAM, , M.2 SSD.

Spec:
Item Type: Copper Pad Shim
Material: Copper
Thermal Conductivity: 401w/mk
Applicable: Desktop, Laptop, IC Chip, CPU, VGA, RAM, VRAM, , M.2 SSD

How to Use:
use after installation

Package List:
100 xCopper Pad Shim

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