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Fydun BGA Universal Reballing Rework Stencil Set Mesh for Laptop Desktop Communication Main Board Graphics Card 130pcs

KWD 11.500
Brand
Fydun
Weight
207 g
– 1 +

Special Features

  • [Clearly Marked] The specifications are visibly marked on the surface, making it convenient for users to select the appropriate stencil for the job.
  • [ Material] These stencils are crafted from top-notch stainless steel with mesh thickness, ensuring durability and reliability.
  • [Multiple Sizes] With 6 different sizes and a total of 130 pieces, this set offers versatility to handle various bga reballing needs efficiently.
  • [Wide Application] Specifically designed for bga chips on laptops, desktops, communication main boards, north-south bridges, and graphics cards, catering to diverse reworking requirements.
  • [Easy to Use] Compatible with hot air machines, these stencils remain sturdy and undistorted even under heat, providing a hassle reballing experience.

Description

Specification:

Material: Stainless Steel
Color: Silver
Quantity: 130pcs
Weight: Approx. 268g / 9.5oz

Package List:
3pcs x BGA Stencils for 0.35mm Solder Ball
2pcs x BGA Stencils for 0.4mm Solder Ball
7pcs x BGA Stencils for 0.45mm Solder Ball
35pcs x BGA Stencils for 0.5mm Solder Ball
60pcs x BGA Stencils for 0.6mm Solder Ball
23pcs x BGA Stencils for 0.76mm Solder Ball

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