CPU Socket: Intel Purley – EP / EX, Socket LGA 3647
Certifications: RoHS Compliant
Dimensions: 90 x 90 x 27 mm
Material: Copper1100 Stacked Fin Heatsink with Vapor Chamber Base
Description
Dynatron B6 1U Passive CPU Cooler
Copper skived fin passive heatsink for 1U server solution up to TDP 205 Watts.
PRODUCT SPECIFICATIONS:
CPU Support: Intel
CPU Socket: Intel Purley – EP / EX, Socket LGA 3647
Solution: 1U Server and Up
Dimensions: 90 x 90 x 27 mm
Weight: 420 g
Material: Copper1100 Stacked Fin Heatsink with Vapor Chamber Base
Thermal Grease: Shin-Etsu 7762 Pre-printed
CERTIFICATIONS: RoHS Compliant