The Gelid-Solutions GC-4-3.5g Thermal Compound is a state-of-the-art thermal compound designed for professional and extreme users who require the best thermal interface for their CPUs, GPUs, chipsets, and other mission-critical applications. It is engineered to provide ultra-efficient heat transfer, ensuring optimal cooling performance. The compound incorporates a polymer matrix that acts as a binder for the thermal filler particles, ensuring proper distribution of the filler and helping in achieving perfect gap filling between the heat source and the cooling solution. It also contributes to the overall viscosity of the compound, allowing for easy application. The compound offers excellent stability and performance over a wide temperature range, from -30 to 150°C, and remains effective without curing or hardening over time, ensuring long-lasting and consistent thermal conductivity.