Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.
40 second bonding range when dispensed at low-melt temperature.
Bonds wood, corrugated, polyolefins and other light-weight materials.
FDA listed.
3M Stock # 7000000880, Series 3792LMQ
Description
8" - 3M 3792LMQ Low-Melt Glue Sticks. Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam. 40 second bonding range when dispensed at low-melt temperature. Bonds wood, corrugated, polyolefin and other light-weight materials. FDA listed.