Search

Home / Thermal Grizzly / Fans & Cooling
-33%
Thermal Grizzly - Minus Pad 8 (30x30x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad - Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox in Kuwait Thermal Grizzly - Minus Pad 8 (30x30x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad - Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox in Kuwait Thermal Grizzly - Minus Pad 8 (30x30x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad - Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox in Kuwait Thermal Grizzly - Minus Pad 8 (30x30x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad - Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox in Kuwait Thermal Grizzly - Minus Pad 8 (30x30x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad - Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox in Kuwait Thermal Grizzly - Minus Pad 8 (30x30x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad - Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox in Kuwait Thermal Grizzly - Minus Pad 8 (30x30x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad - Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox in Kuwait Thermal Grizzly - Minus Pad 8 (30x30x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad - Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox in Kuwait Thermal Grizzly - Minus Pad 8 (30x30x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad - Elastic and Adaptable Silicone Thermopad CPU/GPU/PS4/PS5/Xbox in Kuwait

Thermal Grizzly Minus Pad 8-30x30x2.0mm Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & Compressibility for SSDs, GPUs & Electronics

KWD 2.500

Category
Fans & Cooling
Weight
10 g
Size30 × 30 × 2 mm
1 +

Special Features

  • THERMAL CONDUCTIVE PAD - It effectively dissipates significant amounts of heat thanks to its unique composition of Ceramic Silicone and Nano-Aluminum Oxide
  • FLEXIBLE STRUCTURE - The thermal padding compensates for even the smallest gaps between components with its flexible structure and high heat conductivity
  • USED IN VARIOUS SCENARIOS - It is utilized in situations where thermal paste cannot be applied, such as cases with large air gaps or uneven surfaces
  • GREAT RESULTS - By filling small gaps with its flexible and highly conductive structure, the Thermal Pad effectively dissipates heat between components
  • 8W/(m·K) THERMAL CONDUCTIVITY - With a highly conductive and versatile nature, it is suitable for a wide range of configurations with basic to high requirements

Related Items


{"error":"Error","cart_limit":"You have too many items in your cart.","prod_limit":"You cannot add any more of this item"}