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FN231 Soldering Flux for Electronics NoClean Paste Gel RMA ROL0 in 10g Syringe for Repair and Soldering Printed Circuit Boards.

KWD 6.500

Brand
Diamond Flux
Weight
11 g
1 +

Special Features

  • Diamond flux FN231. Class ROL0 NoClean. Suitable for Soldering of Lead and Lead-Free Alloys. Perfect Wettability of Soldered Surfaces.
  • Low Activity Soldering Flux for Not Highly Oxidized Surfaces, Components and PCBs. Ideal for Repairing and Soldering Electronic Components onto Clean Printed Circuit Boards.
  • For Soldering and Repairing FPGA, BGA, QFN, QFP, SOIC and other Cases of Microcircuits. For Any SMD and DIP Components.
  • Soldering Flux for Critical Printed Circuit Boards, Where Neutrality and Passivity of Indelible Flux Residues are Required. Solder Flux Residue not Conducting, not Corrosive. Conforms to Standard J-STD-004B and ROHS.
  • Soldering Flux Residues Can Be Easily Cleaned Off with PCB Cleaner for Electronic Printed Circuit Boards if Necessary.
  • The Life Circle is Unlimited, but Stability is Indicated on the Syringe Sticker.

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{"error":"Error","cart_limit":"You have too many items in your cart.","prod_limit":"You cannot add any more of this item"}