Specification:
Thermal Conductivity: 2.1±10%W/mK
Thickness: 0.2 mm
Dielectric Breakdown Voltage(Vac): 3.6 KV/mm
Dielectric Breakdown Voltage(Vdc): 4.6 KV/mm
Density: 2.3±5%g/cm³
Operating Temperature: -45~170°C
Reinforcement Carrier: Fiberglass mesh
Holding Power 1000g@25°Cusing 1 in2: >40000
Holding Power 1000g@80°Cusing 1 in2: >40000
(T-Global guarantees a 6-month shelf life at maximum continuous storage temperature of 25°C for maintenance of controlled adhesion to the liner.)
*Protective film may be different colors according to the model, it does not affect the function of the product.
Application:
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
Operating Manual:
1.When using thermal conductive double-sided tape, keep the adhesive surface clean and dry.
2.After tearing off the protector of the thermal tape, pressed it evenly (just a little strength) with your fingers to make sure the tape has greater contact with the surface.
3.The viscosity of the thermal tape have initial viscosity (40% of its maximum viscosity) and persistent viscosity. At room temperature, it takes 72 hours to achieve the maximum adhesive strength.
4.In the application process, appropriate heating (60 ~ 70 °C) will greatly contribute to the effective of adhesive, and as soon as possible to achieve maximum adhesion. In the lower temperature of the winter, appropriate heating is a tip to increase the viscosity of the thermal tape.
Storage:
Store in a cool, dry place away from direct sunlight.