الاجهزه الالكترونيات الامريكية قد تحتاج الى محمول فولت من ١١٠ الى ٢٢٠.قد تحتاج إلى محول كهرباء
مميزات خاصة
Pre Positioning Holes: PCB is designed with a sunken gold process, with multiple slots and positioning holes reserved for easy embedding and integration, and aluminum alloy heat sink for good heat dissipation.
Support OS: Adapter supports for , for and other systems, just plug in the USB interface, install the driver for simple configuration, you can achieve high speed 5G networking.
Network Indicator: On board power and network indicator, with multiple pads reserved for viewing module working status and testing other functions
Support Devices: Support direct plug in or via USB adapter for computers, for 4B 3B+, for CM4 IO BASE A B motherboard and for Nano series main control board to access the Internet.
Support Interface: Expansion board supports M.2(NGFF) Key B interface for 5G modules, USB 3.1 Type A interface for NANO SIM cards
وصف
Specification:
Item Type:NGFFM.2toUSB5GAdapter
Material: PCB
Model: USB TO M.2 B KEY
Adaptation: Can be Adapted for SIMCom 5G Module (All Not Included in the Package).
SIM8202G M2: for Snapdragon X55 in China, USA, Japan, Korea, Europe, Middle and America
SIM8262E M2: for All Regions Except Americas, for Snapdragon X62
RM500Q GL: for Snapdragon X55 Worldwide (Excluding the US)
RM500Q AE: for Worldwide (Excluding China), for Snapdragon X55
RM502Q AE: for Worldwide (Excluding China), for Snapdragon X55
Package List:
1 x Expansion Board
1 x Adapter Cable
2 x Heat Sink
5 x Rubber Hat
1 x Heat Sink Sticker
4 x Wires
8 x Screw Post
2 x Large Screws
4 x Small Screws
4 x Antenna