Specification: Thermal Conductivity: 3.3 W/mKThickness: 0.5 mmColor: BlueReinforcement Carrier:Fiberglass meshDielectric Breakdown Voltage: 8 KV/mmDensity: 3.1 g/cm³Working Temperature: -40-200°CVolume Resistance: 3x10^12Elongation: 110 Percent ,Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc. Features: Great thermal conductivityDifficult to be deformedEasy to assembleFiberglass on one side By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Operating Manual: 1. When using thermal interface material, keep the product surface clean and dry.2. A part is covered by a protective film and a release paper (underneath).3. After tearing off the release paper, gently attach the thermally conductive silicon pad to the heat source.4. Remove the protective film5. Apply components onto the exposed part and apply pressure at fixture. Storage: Store in a cool, dry place away from direct sunlight.