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مبرد ذاكرة الوصول العشوائي المكتبي LM YN بالوعة الحرارة من النحاس النقي - عبوة من قطعتين

KWD 4.500

1 +

مميزات خاصة

  • Upgraded Model , we have upgraded the product and changed the material from aluminum to pure copper. And the back adopts a full-bump design, which greatly increases the heat exchange area.
  • And retains the thermal double-sided adhesive on the back for easy installation.
  • Product material: pure copper. (Also called red copper, with a copper content of about 99.6%, it is widely used in electrical and electrical fields as electrical and thermal conductive materials.)
  • It is suitable for DDR, DDR1, DDR2, DDR3, DDR4,DDR5 PC memory module cooling.
  • Pack of 2 That is your order Qty "1", the package contains two memory heat sinks..Compared with other hard copper alloy products, this pure copper product is so soft that it can be easily deformed by external force. So when you receive the products and find that they have been deformed due to transportation, etc., do not worry, just press them gently to make them flat an.

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