Includes 40pcs copper pad shim, low profile 20mm x 20mm / 0.8 x 0.8 inches, in 6 thicknesses.
Includes 7pcs of these thicknesses: 0.3mm, 0.5mm, 0.8mm, 1mm.
Includes 6pcs of these thicknesses: 1.2mm, 1.5mm
[Main Body Material: Copper]. Thermal conductivity: 401W/mK; can be applied for gap filler in thermal heat sink and cooling of the Development Boards Laptop GPU VGA VRAM RAM IC Chips PS5 M.2 NVMe SSD, etc
Description
Thermal conductive heatsink copper pad shims kit
[Main Body Material: Copper]. Thermal conductivity: 401W/mK.
40pcs 20mm x 20mm (0.8x0.8 inches) 6 thickness copper pad shim heat sink includes:
7pcs (0.3mm)
7pcs (0.5mm)
7pcs (0.8mm)
7pcs (1mm)
6pcs (1.2mm)
6pcs (1.5mm)
Can be applied as a gap filler, cooler thermal conductive pad in cooling of the Development Boards Laptop CPU VRAM GPU VGA RAM IC Chips PS5 SSD M.2 NVMe 2280, etc