1. Precision Adjustment: The adjustable outlet design allows for precise control during the pouring of excess tin balls, ensuring accurate placement for various chip sizes and improving the efficiency of manual soldering tasks significantly.
2. Wide Compatibility: This station supports chips ranging from approximately to making it a broad spectrum of digital products including laptop CPUs and mobile phone components requiring BGA rework.
3. Robust Material: Constructed from solid aluminum alloy, this reballing station offers superior wear resistance and prevents oxidation, providing a stable and reliable platform for repeated use in professional electronics repair environments.
4. Diagonal Design: Featuring a diagonal ball planting structure, this tool facilitates easier and more uniform coating of solder balls, which is essential for achieving consistent results when working with complex BGA chips.
5. Complete Kit: The package includes one BGA reballing station and a hex wrench, offering all necessary components for immediate setup and use, streamlining the process for technicians performing manual soldering and rework operations.
Description
Specification
Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clam chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clam chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.
Voltage Parameter
How to Use
Package List
1 x BGA Reballing Station
1 x Hex Wrench
Note