[PREMIUM SK5 STEEL] Crafted from high-carbon SK5 steel, these BGA repair blades offer exceptional hardness (HRC 58-62) and toughness for professional-grade performance. The special quenching process enhances thermal stability, making them ideal for use near 200-400°C hot air rework stations.
[ULTRA-THIN 0.38MM DESIGN] At just 0.38mm thick, these blades easily slide under modern BGA packages without damaging solder joints (typically 0.3-0.5mm height). The thickness prevents pad lifting during chip removal on smartphones, tablets, and other delicate electronics.
[MULTI-FUNCTIONAL APPLICATION] Perfect for removing power supply chips, CPU glue, baseband adhesive, and cutting underfill material. The blades work on various devices including mobile phones, tablets, laptops, and gaming console circuit boards.
[HEAT WEAR] Engineered to withstand repeated exposure to high temperatures during BGA rework. The oxidationcoating maintains sharpness through extended use on multiple repair jobs.
[PROFESSIONAL 3-PACK SET] Includes three blades for comprehensive repair needs - ideal for electronics repair technicians, hobbyists, and phone repair shop professionals working on diverse PCB layouts and chip packages.
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