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HURRISE Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair in Kuwait HURRISE Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair in Kuwait HURRISE Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair in Kuwait HURRISE Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair in Kuwait HURRISE Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair in Kuwait HURRISE Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair in Kuwait HURRISE Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair in Kuwait HURRISE Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair in Kuwait

HURRISE Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair

KWD 3
– 1 +

Special Features

  • [COMPATIBILITY]: Universal BGA Reballing Stencil, designed for BGA IC chips in smartphones. Please ensure compatibility by checking your device specifications before using. This stencil accommodates various pitch sizes, ensuring it meets the needs of diverse mobile repair tasks.
  • [HIGH- DESIGN]: Universal BGA Reballing Stencil, crafted with to provide accurate tin implantation. Featuring three types of holes with pitch sizes of 0.3mm, 0.35mm, 0.375mm, 0.4mm, and 0.5mm, this template ensures Durability-Optimized even under high-temperature conditions.
  • [COMPACT AND PORTABLE]: Universal BGA Reballing Stencil, designed with a compact appearance for ease of transport and usage. This lightweight and portable stencil makes it convenient for technicians to carry it to various repair locations, enhancing productivity.
  • [VERSATILE APPLICATION]: Universal BGA Reballing Stencil, suitable for a wide of common IC chips in modern smartphones, making it a versatile tool for repairs. Whether you're a professional repair technician or a DIY enthusiast, this stencil will meet your reballing needs.
  • [ STAINLESS STEEL CONSTRUCTION]: Universal BGA Reballing Stencil, made from premium stainless steel. Its material ensures longevity and resistance to damage, providing excellent value for technicians who require reliable tools for electronic repair tasks.

Description

Specification

Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.375mm/0.015in, 0.4mm/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel

Voltage Parameter

How to Use

Use directly

Package List

1 x BGA Reballing Stencil

Note

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