General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
ph II X4
Model number ?
830
CPU part number
HDX830WFK4DGM is an OEM/tray microprocessor
Stepping codes
AACAC ACCACAC AC
Frequency ?
2800 MHz
Bus speed ?
667 MHz Memory controller
One 2000 MHz 16-bit HyperTransport link (4 GT/s)
Clock multiplier ?
14
Package
938-pin organic micro-PGA
Sockets
Socket AM2+
Socket AM3
Weight
1.3oz / 38.2g
Architecture / Microarchitecture
Microarchitecture
K10
Platform
Dragon
Processor c ?
Deneb
c stepping ?
RB-C3
CPUID
100F43
Manufacturing process
0.045 micron silicon-on-insulator (SOI) technology
758 million transistors
Die
258mm2
Data width
64 bit
The number of CPU cores
4
The number of threads
4
Floating Point Unit
Integrated
Level 1 cache size ?
4 x 64 KB 2-way set associative instruction caches
4 x 64 KB 2-way set associative data caches
Level 2 cache size ?
4 x 512 KB 16-way set associative exclusive caches
Level 3 cache size
Shared 6 MB 48-way set associative cache
Cache latency [1]
3 (L1 cache)
15 (L2 cache)
49 (L3 cache)
Virtual memory
256 TB
Multiprocessing
Uniprocessor
Extensions and Technologies
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
AMD64 / A 64-bit technology ?
EVP / Enhanced a Protection ?
AMD-V / A Virtualization technology
Low power features
Cool'n'Quiet 3.0
CoolCore Technology ?
Dual Dynamic Power Management ?
c C1 and C1E states
Package S0, S1, S3, S4 and S5 states
Integrated peripherals / components
Integrated graphics
None
Memory controller
The number of controllers: 1
Memory channels: 2
Channel width (bits): 72
Supported memory: DDR2-1066, DDR3-1333
DIMMs per channel: up to 2
Maximum memory bandwidth (GB/s): 21.3
Other peripherals
HyperTransport 3 technology
Electrical / Thermal parameters
Thermal Design Power ?
95 Watt