FOUR PITCHES: The BGA reballing stencil features three hole types - 0.3mm, 0.35mm, 0.4mm, and 0.5mm pitch, with four spacing options and multiple sizes.
PRECISE POSITIONING: This stencil ensures fast and accurate tin implantation, maintaining its shape even under high temperatures.
COMPACT DESIGN: Compact and portable, this stencil is easy to carry and convenient to use wherever you go.
VERSATILE USAGE: for a wide range of IC chips commonly found in cell phones, making it a versatile tool for various repair needs.
PREMIUM MATERIAL: Crafted from durable stainless steel, this stencil is long-lasting and to damage for prolonged use.
Item Type: BGA?Reballing?Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel
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BGA?Reballing?Stencil