[PREMIUM STAINLESS STEEL CONSTRUCTION] These BGA reballing stencils are crafted from high-quality 304 stainless steel, ensuring exceptional durability and heat resistance. The advanced calcination process enhances thickness accuracy and structural integrity, making them ideal for repeated use in professional repair environments without warping or bending under high temperatures.
[HEAT- & DEFORMATION-FREE] Designed to withstand intense heat from hot air blowers, these BGA templates maintain their shape and stability during prolonged heating sessions. Their robust build prevents warping, ensuring precise solder ball alignment every time, which is critical for flawless CPU, GPU, and motherboard repairs.
[9 VARIED SIZES FOR VERSATILE USE] This comprehensive kit includes 9 different sized templates (0.3mm to 0.76mm) with varying pitch configurations, catering to a wide range of BGA reballing needs. Each template is silver tin-implanted for enhanced performance, making them suitable for intricate chip repairs across multiple devices.
[CLEARLY MARKED FOR EASY IDENTIFICATION] Every BGA rework station stencil features -etched size markings for quick and hassle-free selection. The labeled specifications eliminate guesswork, allowing technicians to efficiently switch between templates during complex repair tasks without delays.
[WIDE COMPATIBILITY FOR MULTIPLE DEVICES] These universal BGA stencils are engineered for compatibility with laptops, desktops, communication motherboards, and graphics cards. Their precision-cut design ensures seamless application on north/south bridges, CPUs, and other critical components, making them indispensable for professional electronics repair workshops.

Spec:
Item Type: BGA Reballing Stencils
Material: 304 Stainless steel
Size(LxW): Approx. 90 x 90mm / 3.54 x 3.54in
9pcs Templates Included:
1 Piece 0.3mm Universal Template (P=0.58mm)
1 Piece 0.35mm Universal Template (P=0.65mm)
1 Piece