[ STAINLESS STEEL] These BGA reballing stencils are crafted from premium stainless steel ensuring durability and longevity. The perfect thickness of the steel mesh provides excellent precision for reballing tasks. Unlike inferior materials these stencils maintain their integrity even under high temperatures making them a reliable tool .
[HEAT & DURABLE] Designed to withstand direct heat from hot air machines these stencils do not deform or warp during use. The high temperature resistance ensures consistent performance making them ideal for repeated reballing operations. This feature guarantees accurate solder ball placement every time you use them.
[COMPREHENSIVE SET OF 130PCS] This kit includes 130 pieces of stencils in 6 different sizes catering to a wide range of BGA chip requirements. Whether you're working with 0.35mm or 0.76mm solder balls this versatile set has you covered. The extensive variety ensures you have the right stencil for any job.
[CLEARLY MARKED SPECIFICATIONS] Each stencil is labeled with its specifications for easy identification and selection. This user friendly design saves time and reduces errors during reballing. The clear markings ensure you can quickly find the right stencil for your specific BGA chip needs.
[VERSATILE APPLICATION] Specially designed for laptops desktops communication main boards north south bridges and graphics cards these stencils handle all kinds of BGA chips. Their universal compatibility makes them a must have tool for electronics repair professionals and hobbyists alike.

Spec:
These stencils were made by material, can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Features:
These stencils are made of stainless steel, the thickness of steel mesh is perfect.
They can be heated by the hot air machine, these stencils are not easy to deform when heated.
There are 6 different sizes and totally 130pcs, enough to meet your