[Efficient Tin Coating]Enhances tin coating speeds without deformation, ideal for A53 and A536 CPU applications to improve your reballing efficiency.
[Precision Positioning]Compact design allows for easy placement, reducing corner break risks on small ICs during the engraving process.
[Robust Material]Constructed from stainless steel, ensuring durability and reliability in demanding reballing tasks.
[Versatile Use]Compatible with multiple devices including A33, A536, A13, and A21s, making it a versatile tool for various tech repairs.
[Portable Design]Lightweight and easy to handle, perfect for on-the-go repairs or professional workshops.

Item Type: Phone Tin Reballing Stencil
Material: Stainless steel
Pitch: Approx. 0.12mm / 0.005in
Applicable : Suitable for A33 A53 A536 A13 A21S M33, etc.
1 x Phone Tin Reballing Stencil