Dynatron Q17 Socket LGA 1700/1851 Copper CPU Heatsink 195W TDP
Special Features
Supports Intel Socket LGA 1700/1851
Copper Heatsink with Skiving Fins
Supports up to 195W TDP @ 30°C Ambient Temp
Pre-applied Shin-Etsu X23-8195 Thermal Grease
Dimensins: 3.7" x 3.7" x 1.06"
Description
Recommend for Intel Alder Lake S Processor, Socket LGA 1700/1851, Copper heatsink with skiving fins. Support 195 Watts CPU Power Heat Dissipation for 1U & Up Server Solution.
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