[Ic Protection Design] The specially designed ic slots prevent small ic tin from sticking and protect delicate components from breaking corners. this innovative feature minimizes damage during rework processes while maintaining consistent performance across multiple applications.
[Wide Compatibility] Engineered to work with various cpu including 660 sm6150 mt6762 and a60 a90 series a10s a605f a705f a920f. this versatile stencil covers multiple device repairs with one professional grade tool saving time and resources.
[Premium Durability] Constructed from stainless steel with a reinforced standard design this stencil offers exceptional sturdiness for long term use. the material withstands frequent rework sessions without compromising performance or precision.
[Portable Efficiency] Compact and lightweight this rework stencil provides convenience for technicians. its ergonomic design allows for easy transportation and simple operation making it perfect for both workshop and on site repair scenarios.
[High Precision Performance] This bga reballing stencil ensures fast tinning speed and accurate positioning with its cut design. the premium stainless steel material resists deformation under high temperatures making it ideal for repeated professional use. its precision engineered slots guarantee perfect solder ball placement every time.

Spec:

Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For , 660, SM6150, MT6762 CPU.
Applicable Product Model: For A60-A90 series, A10S, A605F, A705F, A920F.

Package List:
1 x
Phone CPU BGA Reballing Stencil

How To Use:
Direct use.