وسادة تبريد حرارية من السيليكون لتبريد وحدة المعالجة المركزية، 100 × 100 × 1 مم، توصيل حراري عالي، مادة سيليكون متينة - تبديد الحرارة، مقاومة درجات الحرارة العالية، مثالية لـ CP
[High Thermal Conductivity]: Features excellent heat conduction to efficiently transfer heat away from CPU or LED chips, ensuring stable device performance.
[Durable Silicone Material]: Made from high-quality silicone with strong tensile strength and flame retardancy for long-lasting use and safety.
[Wide Temperature Range]: Withstands temperatures from -40℃ to 220℃, suitable for various high and low temperature environments.
[Flexible and Easy to Use]: Malleable pads that conform to surfaces easily, improving thermal contact and simplifying installation and replacement.
[Compact and Portable]: Small size of 100 x 100 x 1mm makes storage and transportation convenient, perfect for DIY cooling solutions and maintenance.
وصف
Item Type: Thermal Silicone Heatsink Pad
Material: Silicone
Thermal Conductivity: 5.0
Density: 2.35
Hardness: 30
Dielectric Constant: 260±18
Temperature.: -40℃ ~ 220℃
Withstand Voltage: > 4kv
Hardness: 13c ~ 50C
Flame Retardancy: UL94 V0
Tensile strength (PSI)35
Size: Approx. 100 x 100 x 1mm / 3.94 x 3.94 x 0.04in