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Semme Semme 100 قطعة من الوسائد الحرارية النحاسية عالية الأداء لتبديد الحرارة بكفاءة في بطاقة رسومات وحدة المعالجة المركزية للكمبيوتر المحمول والمزيد (20 * 20 * 1.0 مم) (20 * 20 * 0.5 مم) in Kuwait

20*20*0.8 مللي متر

KWD 8.500

مقاس20*20*0.8mm
1 +

مميزات خاصة

  • Wide Applicability - The high thermal conductivity and heat dissipation properties of our copper heat sink pads make them suitable for a wide of devices. Whether it's desktop or laptop IC chips, graphics cards, CPU, VGA, , VRAM, , or M.2 SSDs, these pads ensure efficient heat management and optimal performance across multiple applications.
  • Enhanced Thermal Conduction - Our copper pads excel in heat conduction and crack filling between your graphics cards and cooling modules. By improving thermal conduction, they significantly reduce the repair rate of graphics cards, ensuring prolonged device lifespan and reliability even during intensive usage.
  • Exceptional Heat Dissipation - With a remarkable thermal conductivity rating of 401w/mk, these copper pads provide outstanding heat dissipation for your equipment. This feature is for maintaining optimal operating temperatures, thereby enhancing the overall performance of your systems during high-demand tasks and gaming sessions.
  • Fit - Each copper pad boasts a glossy with slippery edges and corners, ensuring a fit for your equipment. Plus, the absence of burrs contributes to smoother installation and improved performance, making these pads a reliable choice for your cooling needs.
  • Complete Set of Sizes - Our package includes 100 copper pad spacers in five different sizes: 20x20x0.3mm, 20x20x0.5mm, 20x20x0.8mm, 20x20x1.0mm, and 20x20x1.2mm. This versatility allows for easy customization, ensuring you have the right pad for any device, providing the best thermal performance possible.

وصف

1. Applicability: High thermal conductivity and heat dissipation copper sheet is suitable for desktop laptop IC chips, graphics cards, CPU, VGA, RAM, VRAM, , M.2 SSD.
2. Function: Heat conduction and crack filling between the graphics card and the cooling module, improve heat conduction and reduce the repair rate of the graphics card.
3. Strong Heat Dissipation: Its thermal conductivity is as high as 401w/mk, which can provide strong heat dissipation for your equipment.
4. Fitting Equipment: Glossy , slippery edges and corners, no burrs, more suitable for your equipment.
5. Included: Includes 100 copper pad spacers, 20x20x0.3mm, 20x20x0.5mm, 20x20x0.8mm, 20x20x1.0mm, 20x20x1.2mm five sizes are available.

Specification:
Item Type: Heatsink Copper Pad
Material: Copper
Thermal Conductivity: 401w/mk
Applicable: Desktop Laptop IC Chip CPU VGA RAM VRAM M.2 SSD

How to Use:
Install to use

packing list:
100 x Heat Sink Copper Sheet

منتجات شبيهه


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