All electronics ship with US style plugs.You may need a voltage converter or a plug adapter.
Special Features
Versatile BGA Rework Station: This BGA Reballing Station is an essential tool for mobile phone chip rework and various soldering tasks. The comprehensive Reballing kit supports multiple mold sizes, making it ideal for a wide range of applications, including precise BGA chip rework
Precision Engineering Design: Designed to accommodate chip sizes up to 50 x 50mm, our BGA Reballing Station features a 90mm x 90mm BGA reball stencil that simplifies the removal of excess solder balls with its practical groove. The scaled tin planting table ensures faster and more accurate positioning during soldering operations.
User-Friendly Operation: The BGA reballing platform addresses the challenges of advanced chip soldering by ensuring high welding quality and easier troubleshooting. Its design focuses on the precise mounting and repairing of BGA chips equipped with matrix-arranged solder balls, making the entire process seamless
Durable Aluminum Alloy Construction: Constructed from lightweight yet strong aluminum alloy, this BGA ball planting table offers durability without unnecessary weight. The sturdy construction is designed to withstand wear and tear in demanding environments, enhancing your soldering pad's longevity
Complete Package for Immediate Use: The BGA Reballing Station comes with everything you need right out of the box: Reballing Station x 1, 10 BGA reballing stencils, and a hex wrench for adjusting the slider position. This package is thoughtfully designed to facilitate setup and operation, ensuring you have the necessary tools at your fingertips for efficient soldering and repair work