مميزات خاصة

Versatile 6-in- Design - This unique stencil template allows you to implant multiple chips efficiently, making it an excellent choice for various BGA applications. Its versatile design caters to a of BGA formats such as BGA153, BGA162, and more, thus simplifying your project tasks and enhancing productivity with every use.
Stainless Steel - Crafted from premium stainless steel, these stencils boast a thickness for durability and effectiveness. This material provides resistance to wear and tear, ensuring that the stencils maintain in every reballing project. Experience superior performance and longevity in your repair and soldering tasks.
Heat Dissipation Innovation - The innovative plump design of these stencils effectively facilitates heat dissipation during soldering. This feature minimizes the of overheating and potential damage to your components, ensuring that each chip is reballing safely and accurately, leading to better performance and reliability.
Quick and Easy Reballing - Engineered for efficiency, these stencils make the reballing of BGA ICs fast and uncomplicated. Save time and effort with this user-friendly accessory, which is designed to simplify your soldering process. for both professionals and hobbyists, enhancing the rework capabilities at an economical .
Tailored for Multiple BGA Types - Specifically designed for a variety of BGA types, including BGA186, BGA221, BGA254, and EMMC, these stencils are essential tools for PCB repair technicians. Their precise engineering allows for accurate imprinting, leading to solder joints and reducing the occurrence of errors in your projects.

وصف

1. 6 in 1 design, which can implant a plurality of chips
2. These stencils were made of stainless steel plate, the thickness of steel mesh is appropriate.
3. It adopted the special plump design which can avoid Heat dissipation
4. It is easy and fast for reballing the BGA IC, useful and economical accessories for BGA soldering.
5. It is specially designed for BGA153/162/169/186/221/254/EMMC

Spec:
Features: 1.6 in 1 design, which can implant a plurality of chips.
2.These stencils were made of stainless steel plate, the thickness of steel mesh is appropriate.
3.It adopted the special plump design which can avoid Heat dissipation.
4.It is easy and fast for reballing the BGA IC, useful and economical accessories for BGA soldering.
5. It is specially designed for BGA153/ 162/ 169/ 186/ 221/ 254/ EMMC.

Specifications:
Material: Stainless Steel
Weight: Approx. 6g
Compatible with: BGA162, BGA153, BGA169, BGA221, BGA186, BGA297, BGA254, BGA178, BGA200, BGA110, BGA60, BGA70

Package Included:
1 x BGA stencils

Note:
1.Please allow 1-3 cm error due to manual measurement. Thanks for your understanding.
2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.

مرحبًا،

بحث

Pongnas استنسل عالمي 6 بوصات لقوالب BGA reballing المتوافقة مع BGA153/162/169/186/221/254/EMMC

مميزات خاصة

وصف

منتجات شبيهه