مميزات خاصة

[VARIED PITCHES] The universal BGA reballing stencil comes with four different pitches, catering to various needs and ensuring versatility in your repairs.
[STURDY CONSTRUCTION] Made of premium stainless steel, the tin mesh solder template is robust and long-lasting, ideal for frequent use in repairs.
[ON-THE-GO REPAIRS] Easily carry the compact BGA reballing stencil for convenient repairs wherever you go.
[ENHANCED STABILITY] The precise positioning of the tin mesh solder template ensures stable soldering even at high temperatures.
[EFFORTLESS USAGE] Simply use the BGA reballing stencil directly for a hassle- and efficient repair process.

وصف

1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
2. PRECISE POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
3. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
4. VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
5. STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.

Specification:
Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel

How to Use:
Use directly

packing list:
1 xBGA Reballing Stencil

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بحث

Vikye Compact BGA Reballing Stencil قالب زراعة القصدير لتحديد المواقع بدقة لإصلاح الهاتف، مادة من الفولاذ المقاوم للصدأ

مميزات خاصة

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