مجموعة استنسل BGA Reballing مكونة من 9 قطع، مجموعة قالب لحام عالمي 90 × 90 مم 0.3-0.76 مم 304 من الفولاذ المقاوم للصدأ لأجهزة الكمبيوتر المحمول أداة إصلاح محطة إعادة العمل لشريحة وحدة المعالجة المركزية
Comprehensive 9-Piece Set: This kit includes 9 distinct universal reballing stencils to meet diverse repair needs: 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm (0.9mm pitch), 0.6mm (1.0mm pitch), and 0.76mm. This variety ensures compatibility with a wide range of chip specifications and solder ball sizes.
Standard 90x90mm Dimensions: Each template measures approximately 90mm x 90mm (3.54 x 3.54 inches), designed to fit standard BGA rework stations and ball implantation tables. The standardized sizing facilitates easy alignment and secure fixation during the soldering process.
Durable 304 Stainless Steel: Manufactured from 304 stainless steel, these stencils are built to withstand high temperatures and environmental wear. The material features a specialized thickness to prevent warping when used with a hot air gun, maintaining a flat profile for precise tin bead application.
High-Visibility Markings: Each stencil features precision-etched specifications directly on the surface, indicating the hole diameter and pitch (e.g., 0.6mm P=0.9). This allows technicians to identify and select the appropriate template for their specific BGA chip, streamlining the workflow and reducing identification errors.
Versatile Repair Application: Designed for universal usage, these steel meshes are suitable for tin planting on various electronics including laptops, desktops, communication motherboards, north/south bridges, and graphics cards. They effectively assist in repairing cameras, printers, headsets, and computer components.