[Versatile Reballing Station]Suitable for BGA manual soldering and tin rework of both laptops and mobile digital devices.
[Durable Aluminum Construction]Crafted from aluminum alloy for light and wear- performance.
[Adjustable Chip Size]Easily accommodate chips from 9mm to 43mm for varied electronic applications.
[Efficient Tin Management]Features a diversion groove to manage excess solder balls during reballing.
[Complete Kit Included]Comes with BGA reballing station and hex wrench for immediate use and convenience.

Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.
1 x BGA Reballing Station
1 x Hex Wrench