Tflex-700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts.
Compatible with GPU, Graphics VGA cards, M.2 SSD, CPU, Coolers, IC Processor, Laptop, Desktop PC, Mini Desktop, Game Consoles, Memorys, SMD components, Heatsink, 3D Printer, Raspberry Pi etc.
Dimension (Length x Width x Height): 30 x 30 x 1.0 mm
Color: Dark Grey
Construction: Filled Silicone Sheet
Density (g/cm3): 1.70
Hardness (Shore 00): 70
Thermal Conductivity (W/mK): 5w/mK
Continuous Use Temperature: -40°C to -200°C