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Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone in Kuwait Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone in Kuwait Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone in Kuwait Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone in Kuwait Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone in Kuwait Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone in Kuwait Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone in Kuwait Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone in Kuwait Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone in Kuwait

Adjustable BGA Reballing Station Kit, Diagonal Universal Solder Aluminum Alloy Rework Kit for Laptop CPU Mobile Phone

KWD 11.500
Brand
HERCHR
Weight
372 g
– 1 +

Special Features

  • Aluminum Alloy BGA Reballing Stencil: This reballing station adopt aluminum alloy material as structure, light and hard wearing; not easy to oxidize, more wear resisting, and has a long service life; The BGA ball planting station combines lightweight portability with stable support for repeated heating cycles during component maintenance
  • Diagonal Template for Computer CPU Phone Welder: This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating; Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads
  • BGA Reball Stencil for 9-43mm BGA Chip: Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in; more suitable for 9mm to 43mm BGA chip ball planting; This wide compatibility makes it a valuable tool for a variety of electronic components
  • Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in; Application: Diagonal solder ball jig can be widely use for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding
  • Easy to Use BGA Reballing Rework Station: This ball planting rework table is equipped with an automatic centering function. By rotating the spiral disk, multiple positioning holes and multiple locking blocks can simultaneously lock the chip

Description

Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.

Package List：
1 x BGA Reballing Station
1 x Hex Wrench

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