سكين صيانة IC Chip Repair Thin Blade CPU NAND Remover BGA لإصلاح الهاتف المحمول (إزالة وحدة المعالجة المركزية وإزالة الغراء مجموعة مكونة من 5 قطع)
مقاسإزالة وحدة المعالجة المركزية وإزالة الغراء مجموعة مكونة من 5 قطع
مميزات خاصة
- is , not easy to deform when bent, and sturdy.
- The professional repair tool set is suitable for mobile phone CPU disassemble and repair.
- of applications, support motherboard repair, hardware repair, instrument repair.
- Comfortable hand feel, humanized design, double‑headed SK5 blade, used to separate solder joints.
- Used for BGA repair, disassembling mobile phone CPU chip and mobile phone repair.
وصف
Specification:
Item Type: CPU Tool
Blade Material: SK5 Steel
Color: As Picture Shown
Weight: Approx. 60.0g/2.1oz
Product Model: TE-018
Function: Chip removal, cleaning gluescratch padmotherboard parts installation and removal
Function: Disassemble mobile phone IC chip
Application: CPU glue removal tool
packing list:
10 x CPU Tool
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