مبدد حراري نحاسي من دايناترون C4 جرانيت رابيدز، LGA 7529
مميزات خاصة
Supports Intel Granite Rapids SP Processors, LGA 7529
Copper Vapor Chamber with Copper Fins
Supports up to 400W TDP
Pre-applied Shin-Etsu X23-8079-2 Thermal Grease
Dimensions: 4.99" x 3.85" x 1.05"
وصف
Copper vapor chamber with copper fins heatsink for Intel's Granite Rapid, LGA 7529. Supports up to 400W TDP ideal for a 1U server or larger. Includes pre-printed Shin-Etsu X23-8079-2 thermal grease.
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