Features advantages:
● Laptop
● Communication hardware equipment
● High speed hard drive
● Automobile engine control module is fast
● Microprocessor, memory chip and graphics processor
● Mobile devices
● LED lamps, radiators, drivers, memory modules

The aluminum substrate and the like are filled, insulated, shockproof, and thermally conductive with the heat sink or the outer casing, and are tight
The solid device can be used by tearing off the protective film on both sides.

Features:
Ultra-high thermal conductivity, stable and reliable, non-conductive, more durable, safe and reliable!
1. This thermal silica gel pad is imported material, soft insulating material
2. Tear off the two sides of the adhesive tape on the memory, North and South Bridge chips
3. Then install the radiator.
Extremely easy to use, no need to apply silicone grease and copper. Just paste it.
Memory The North Bridge South Bridge power supply module can be used.

Thermal conductivity 6W
Specifications: 20X20MM
Thickness: 0.5MM 1.0MM 2.0MM 3.0MM

Package includes
100pcs double-sided viscous silicone pad