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Supermicro Processor heatsink - (for: Socket P) - 1U

KWD 27.500

Brand
Supermicro
Category
Fans & Cooling
Weight
1.2 kg
1 +

Special Features

  • 1U passive proprietary middle-air-channel CPU heat sink
  • Intel xeon scalable processors
  • socket LGA3647-0 narrow mounting mechanismSpecifications
  • Category (Motherboard): X11 Purley Platform CPU Heat Sink
  • Application: X11 Purley Platform Front CPU Heat Sink for 2U 4 Nodes Twin Pro Square and Big Twin

Description

Features. 1U passive proprietary middleairchannel CPU heat sink. Intel xeon scalable processors. socket LGA36470 narrow mounting mechanismSpecifications. Category Motherboard X11 Purley Platform CPU Heat Sink. Application X11 Purley Platform Front CPU Heat Sink for 2U 4 Nodes Twin Pro Square and Big Twin Square Series Servers. Socket Type LGA 36470 Narrow ILM. CPU Support Intel Xeon Scalable Processors. Mounting Method Screws and Springs. Height 2U. Dimension 25.5 H x 78 W x 108 L mm

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