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RLECS 10PCS IC Chipset/GPU/CPU Thermal Copper Spacers 20x20x0.5mm Heat Conductor Sheet Suitable for Notebook and Memory Modules

KWD 3
Brand
RLECS
Category
Fans & Cooling
Weight
19 g
Size20x20x0.5mm
– 1 +

Special Features

  • Product name: Heat dissipation copper sheet, heat conduction sheet, can be more convenient to the electronic products heat dissipation, make it safe and stable, and efficient.
  • Product material: This gasket is made of high quality pure copper, which effectively reduces the IC chipset/GPU/CPU temperature, improves the performance of the device and prolongs the service life.
  • Product features: This gasket is superbly crafted with a flat and smooth surface, smooth polished edges and corners, no burrs, accurate thickness, can withstand high temperatures up to 160 degrees, more durable, and has excellent heat dissipation properties.
  • Application: Suitable for original heat sinks and third party heat sinks, suitable for chips, notebooks, memory modules and other small electronic devices, effectively solving the heat dissipation problem without heat sinks.
  • Package content: contains 10 pieces of heat dissipation copper sheet, size 20x20x0.5mm/0.79x0.79x0.02inch.

Description

Name: heat dissipation copper sheet, heat conduction sheet.
Material: pure copper.
Colour: copper.
Specification: size 20x20x0.5mm/0.79x0.79x0.02inch.
Application: Suitable for chips, notebooks, memory modules and other small electronic devices, effectively solve the heat dissipation problem without heat sink.
Package content: contains 10 pieces of heat dissipation copper sheet.

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