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High-Performance Thermal Pad for Exceptional Heat Transfer - Soft Silica Gel CPU and LED Heat Conductive Padding for Custom Sizing in Electronics

KWD 0

Brand
Vyroniapog
Category
Fans & Cooling
Weight
71 g
1 +

Special Features

  • 【Enhanced Thermal Management】: Designed with high temperature resistance and low thermal conductivity, this thermal pad ensures maximum heat dissipation, maintaining optimal performance for your CPUs and LEDs.
  • 【Easy Customization】: The soft, low viscosity material allows you to easily cut the pad to any desired size, making it perfect for various electronic components without hassle.
  • 【Versatile Application】: Ideal for use with graphic cards, graphic chips, North-South bridge chips, and memory chipsets, ensuring efficient heat conduction throughout your devices.
  • 【Exceptional Malleability】: Benefit from excellent heat conduction properties and high malleability, which allows for a snug fit around electronic components for improved thermal performance.
  • 【Durable and Safe】: Made from UL94 V0 fire-resistant material, this thermal pad can withstand temperatures from -40°C to 220°C, ensuring longevity and reliable performance in demanding conditions.

Description

[HIGH TEMPERATURE ] Withstand extreme heat conditions, ensuring optimal thermal performance.
[EXCELLENT THERMAL CONDUCTIVITY] Provides efficient heat transfer for effective cooling of CPU chips and LED modules.
[VERSATILE USAGE] Ideal for CPU chip heat conduction, LED heat conduction, graphic cards, North-south bridge chips, and more.
[EASY TO CUSTOMIZE] Malleable design allows for easy cutting to achieve desired sizes for various applications.
[ MATERIAL] Made of high-quality gel with a soft texture, offering long-lasting heat dissipation capabilities.

Spec:
Description:
Brand New High Quality. You can cut the pad into different size according to your needs. installation,maximum heat conduction and increased cooling. Great for graphic cards,graphic chips,North-south bridge chip, memory chipset, IC.

Features:
1. High temperature , low temperature, good thermal conductivity.
2. Soft, low viscosity.
3. Can be used for CPU chip heat conduction or LED heat conduction.
4. Good heat conduction, very good malleability.
5. Can be cut to any desired size.

Specifications:
Condition: Brand New
Material: Gel
Color: Blue
Size: Approx. 100 * 100 * 3 mm / 3.9 * 3.9 * 0.1 in
Thermal Conductivity: 5.0
Density: 2.35
Hardness: 13c - 50c
Permittivity: 260±18
Temperature: -40°C - 220°C
Voltage : > 4kv
Fire : UL94 V0
Tensile Strength:(PSI)35

Package Included:
1 x CPU Thermal Pad

Notes:
1.Please allow 1-3 cm error due to manual measurement. Thanks for your understanding.
2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.

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