Product Overview:
Factory-fresh thermal interface solution. Custom-trimmable for diverse applications. Tool- installation process with lab-verified thermal conductivity (5.0 W/m·K). Engineered for heat dissipation in GPU/CPU assemblies, LED arrays, and integrated circuitry.

Key Features:
Broad operational range (-40°C to 220°C) with stable thermal transfer

Non-adhesive adaptive design for precision fitting

Multi-device compatibility across electronics cooling systems

Optimized durability (Tensile Strength: 35 PSI; Hardness: 13c–50c)

User-adjustable sizing via manual trimming

Technical Specifications:
Material: Synthetic thermal compound

Nominal : 100 × 100 × 3 mm (±3mm manual adjustment variance)

Certifications:

UL94 V0 flammability compliance

Conforms to EU chemical safety directives (ROHS documentation provided)

Dielectric Properties: Withstands >4 kV potential

Thermal Performance: 5.0 W/m·K conductivity (third-party lab validated)

Package Contents:
1 × Factory-sealed thermal pad (unused/original packaging)

Compliance Notes:
Dimensional tolerances account for manual customization.

Color rendering may vary across display devices.

Performance metrics reflect standardized laboratory testing (ambient temp. 25°C).