JacobsParts High Performance Gold Thermal Grease CPU Heatsink Compound Paste Compact Syringe
Special Features
- Polysynthetic gold thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.
- Weight: 1.0g/tube
- Operation Temperature: -50/180°c
- Thermal Conductivity: >3.05W/m.k, Thermal Resistance: <0.073°c-in2/w
- 20% metal oxide compounds
Description
Polysynthetic gold thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.
Weight: 1.0g/tube
Operation Temperature: -50/180°c
Thermal Conductivity: >3.05W/m.k, Thermal Resistance: 20% metal oxide compounds
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