I3-6100 i3 6100 3.7GHZ LGA1151 Dual c desktops CPU scrattered pieces
I c i3-6100 specifications
The specs can be used for short-term
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General information
Type CPU / Microprocessor
Market segment Desktop
Family I c i3
Model number ? i3-6100
CPU part numbers CM8066201927202 is an OEM/tray microprocessor
BX80662I36100 is a boxed processor with fan and heatsink (English version)
BXC80662I36100 is a boxed processor with fan and heatsink (Chinese version)
Frequency ? 3700 MHz
Bus speed ? 8 GT/s
Clock multiplier ? 37
Package 1151-land Flip-Chip Land Grid Array
Socket Socket 1151 / H4 / LGA1151
S-spec numbers
Part number ES/QS processors Production processors
QJZG SR2HG
BX80662I36100 +
CM8066201927202 +
Unknown +
Architecture / Microarchitecture
Microarchitecture Skylake
Processor c ? Skylake-S
c stepping ? S0 (QJZG, SR2HG)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size ? 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size ? 2 x 256 KB 4-way set associative caches
Level 3 cache size 3 MB 12-way set associative shared cache
Physical memory 64 GB
Multiprocessing Uniprocessor
Extensions and Technologies MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
AES / Advanced Encryption Standard instructions
AVX / Advanced Vector Extensions
AVX2 / Advanced Vector Extensions 2.0
BMI / BMI1 + BMI2 / Bit Manipulation instructions
F16C / 16-bit Floating-Point conversion instructions
FMA3 / 3-operand Fused Multiply-Add instructions
EM64T / Extended Memory 64 technology / I 64 ?
NX / XD / Execute disable bit ?
HT / Hyper-Threading technology ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
MPX / Memory Protection Extensions
SGX / Software Guard Extensions
SMAP / Supervisor Mode Access Prevention
SMEP / Secure Mode Execution Protection
Low power features Enhanced / technology ?
Integrated peripherals / components
Display controller 3 displays
Integrated graphics GPU Type: HD 530
Graphics tier: GT2
Microarchitecture: Gen 9
Execution units: 24
Base frequency (MHz): 350
Maximum frequency (MHz): 1050
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
ECC supported: Yes
Other peripherals Direct Media Interface 3.0
PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Maximum operating temperature ? 100°C
Thermal Design Power ? 51 Watt
Notes on I c i3-6100
ECC memory mode is supported only on workstation-class motherboards
The processor has the following security, data protection and/or software features: I Secure Key, Identity Protection technology, OS Guard and Boot Guard.
The CPU is compatible with DirectX 12, OpenGL 4.4, OpenCL 2.0 and Vulkan1.0.31 APIs.
The graphics unit has the following software features enabled: I Wireless Display, Quick Sync Video, Clear Video technology, Clear Video HD technology, InTru 3D technology and Insider.