I5-650*1PCS
c i5-650 specifications
The specs can be used for short-term
listings on auction and classifieds sites
General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
I c i5
Model number ?
i5-650
CPU part numbers
CM80616003174AH is an OEM/tray microprocessor
BX80616I5650 is a boxed processor with fan and heatsink (English version)
BXC80616I5650 is a boxed processor with fan and heatsink (Chinese version)
Frequency ?
3200 MHz
Maximum turbo frequency
3467 MHz (1 c)
3333 MHz (2 cores)
Bus speed ?
2.5 GT/s
Package
1156-land Flip-Chip Land Grid Array (FC-LGA10)
1.48" x 1.48" (3.75 cm x 3.75 cm)
Socket
Socket 1156 / H1 / LGA1156
Weight
0.9oz / 24.6g (CPU)
11.4oz / 324g (box)
Fan/heatsink
E41997-002
Introduction date
January 7, 2010
End-of-Life date
Last order date is June 29, 2012
Last shipment date for tray processors is December 7, 2012
Price at introduction
$176
S-spec numbers
Part number
ES/QS processors
Production processors
Q3GN
Q4DC
SLBLK
SLBTJ
BX80616I5650
+
+
BXC80616I5650
+
+
CM80616003174AH
+
+
+
+
Architecture / Microarchitecture
Microarchitecture
Westmere
Processor c ?
Clarkdale
c steppings ?
C2 (Q3GN, SLBLK)
K0 (Q4DC, SLBTJ)
CPUID
20652 (SLBLK)
Manufacturing process
0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die)
Die
81mm2 (CPU die)
114mm2 (IMC / graphics die)
Data width
64 bit
The number of CPU cores
2
The number of threads
4
Floating Point Unit
Integrated
Level 1 cache size ?
2 x 32 KB 4-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size ?
2 x 256 KB 8-way set associative caches
Level 3 cache size
4 MB 16-way set associative shared cache
Physical memory
16 GB
Multiprocessing
Uniprocessor
Extensions and Technologies
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
AES / Advanced Encryption Standard instructions
EM64T / Extended Memory 64 technology / I 64 ?
VT-x / Virtualization technology ?
NX / XD / Execute disable bit ?
TBT / Turbo Boost technology ?
HT / Hyper-Threading technology ?
VT-d / Virtualization for directed I/O
TXT / Trusted Execution technology
Low power features
Thread C1, C3 and C6 states
c C1/C1E, C3 and C6 states
Package C1/C1E, C3 and C6 states
Enhanced / technology ?
Integrated peripherals / components
Integrated graphics
GPU Type: HD (Westmere)
Base frequency (MHz): 733
The number of supported displays: 2
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
Other peripherals
Direct Media Interface
PCI Express 2.0 interface
Electrical / Thermal parameters
V c ?
0.65V - 1.4V
Minimum/Maximum operating temperature ?
5°C - 72.6°C
Maximum power dissipation ?
6 Watt (TDP in C6 state) / 170.83 Watt (peak)
128.71 Watt (sustained)
Thermal Design Power ?
73 Watt
Notes on I c i5-650
Graphics processor and memory controller are located on a separate die, which is manufactured on 0.045 micron technology
The processor has the following security, data protection and/or software features: I vPro technology.
The CPU is compatible with Shader Model 4, along with DirectX 10.1 and OpenGL 2.1 APIs. OpenCL API is not supported.
The graphics unit has the following software features enabled: I Clear Video HD technology.