Frustrated with inaccurate BGA reballing that ruins expensive chips? Tired of constantly changing frames during critical repair jobs? Our expert BGA Reballing Station solves these headaches with its accurate engineering. The aluminum alloy frame maintains consistent alignment while the dual-frame system keeps your workflow uninterrupted. Experience consistent solder ball placement with the diversion slot that eliminates waste and the large capacity that handles chips up to 50x50mm. Get expert results with this complete kit including all necessary tools for immediate use. Ideal for electronics repair technicians demanding consistency and accuracy in every reballing procedure.\n\nItem Type: BGA Reballing Rework Station
Purpose: BGA chip planting ball
Specification: KF-13 double frame type 80 x 80 tin planting station
Plantable Chip Size: Maximum Size: Approx. 50 x 50mm / 2 x 2in
Applicable Steel Mesh Size: Approx. 80 x 80mm / 3.1 x 3.1in
Note:
This BGA reballing rework station is only suitable for large steel meshes, not for small heating steel meshes.