UPSIREN PCM-1, with 8.5W/mK thermal conductivity, uses high - performance filler and polymer tech for top - notch heat dissipation.
0.25mm thickness and texture upgrade ensure it avoids splitting, validated by over 1000 tests.
Comes in pad and paste formats, making installation easy and suitable for diverse requirements.
Phase - changes at 45°C, continuously and effectively taking away heat during the transformation.
Stays solid at room temperature, softens when heated, maintaining material integrity for long - term use.
وصف
UPSIREN's thermal pad is a game - changer in heat management. It incorporates high - performance filler and advanced polymer technology, ensuring superior thermal conductivity. With a 0.25mm thickness, its upgraded texture prevents splitting, having passed over 1000 tests. Available in both pad and paste forms, it offers easy installation. Phase - changing at 45°C, it efficiently transfers heat, staying solid at room temp and softening upon heating for long - term reliability. Perfect for cooling various electronics.