Thermal Pad used for heat transfer between a CPU/Hard Disc Drives and heat sink
Thermal Conductivity: 6.0 W/mK
Thickness: 0.20mm
Easily cut to match your needed size or chipset
Silicone Free- Ceramic Filled Polyurethane
وصف
In case of concerns about silicone, Kerafol offers a ceramics-filled polyurethane film as a silicone free alternative material. Besides good thermal and outstanding electrical properties, these films are characterized by very good perforation strength. These good physical properties are achieved with an excellent price-performance ratio. MFG C of C not provided with order.